January 2009 - Topics
CeBIT Global Conferences, March 3-6, 2009, Hannover, Germany
How will we be working, living and communicating in a few years' time? How can companies make the most intelligent use of today’s – and tomorrow’s – innovative technologies? And what does the Web have in store for society just around the corner? At the CeBIT Global Conferences in March of 2009, questions like these will be addressed by over 30 outstanding personalities from the global ICT industry – personalities whose bright ideas and entrepreneurial strategies have contributed greatly to the industry, itself, as well as to enriching and transforming our lives.
» Read more
New EITO Partner
MASIT is now official EITO partner
Starting January 1st MASIT, the chamber of commerce for ICT of the Republic of Macedonia, is new official partner of the EITO project. MASIT is thus our local marketing partner for Macedonia and brings its expertise into the EITO Task Force.
» Read more
CeBIT 2009
Visit EITO at the CeBIT tradefair in Hannover, March 3-8, 2009
EITO will be present at the CeBIT tradefair taking place in Hannover on March 3-8, 2009.
We will be placed at booth B12 in area 4. If you plan on visiting us, please feel free to make your date already today.
» Read more
Market news
International IT market is resisting the downturn
Despite the weakness in the international economy, demand for information technology will continue to increase in the coming year. According to our latest forecasts, turnover of IT equipment, software and IT services in Western Europe should increase by 2 percent in 2009, to a round 315 billion Euro. Increasing demand for IT from the public sector will contribute to this growth.
» Read more
EITO Special Report
Special Report: "The financial crisis and ICT markets of Europe"
The new EITO Special Report "The ICT markets of Europe" includes a comparison of the EITO forecasts of April 2008 and revised forecasts for 2008 and 2009. It shows the impact of the financial crisis and the international economic downturn.
» Read more











